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ACM Research Inc ACMR.OQ (NASDAQ Stock Exchange Global Market)

15.16 USD
+0.68 (+4.70%)
As of 4:00 PM EDT
Previous Close 14.48
Open 14.93
Volume 38,231
3m Avg Volume 20,165
Today’s High 15.50
Today’s Low 14.50
52 Week High 17.50
52 Week Low 9.03
Shares Outstanding (mil) 16.08
Market Capitalization (mil) 232.77
Forward P/E 43.31
Dividend (Yield %) -- ( -- )

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RECOMMENDATION

Sell Hold Buy
1.67 Mean rating from 3 analysts

KEY STATS

Revenue (mm, USD)
FY18
75
FY17
37
FY16
19
EPS (USD)
FY18
0.334
FY17
-0.304
FY16
0.066
*Note: Units in Millions of U.S. Dollars
**Note: Units in U.S. Dollars

KEY RATIOS

Price to Earnings (TTM)
vs sector
43.31
11.39
Price to Sales (TTM)
vs sector
3.12
24.61
Price to Book (MRQ)
vs sector
4.43
1.87
Price to Cash Flow (TTM)
vs sector
33.03
14.73
Total Debt to Equity (MRQ)
vs sector
18.05
17.06
LT Debt to Equity (MRQ)
vs sector
0.00
9.88
Return on Investment (TTM)
vs sector
12.77
16.32
Return on Equity (TTM)
vs sector
14.26
17.63

EXECUTIVE LEADERSHIP

David Wang
President, Chief Executive Officer, Founder, Director, Since 1998
Salary: $174,656.00
Bonus: --
Fufa Chen
Vice President of Sales, Since
Salary: $156,554.00
Bonus: --
Sotheara Cheav
Vice President - manufacturing, Director - manufacturing, Since 2015
Salary: --
Bonus: --
Jian Wang
Vice President - Research & Development, Since
Salary: --
Bonus: --
Haiping Dun
Independent Director, Since 2003
Salary: --
Bonus: --

COMPANY PROFILE

Sector: Technology
Industry: Semiconductor Equipment & Testing
Address:

42307 Osgood Rd Ste I
FREMONT   CA   94539-5062

Phone: +1510.4453700

Acm Research, Inc. develops, manufactures and sells single-wafer wet cleaning equipment, which semiconductor manufacturers uses in manufacturing steps to remove particles, contaminants and other random defects in fabricating integrated circuits, or chips. The Company’s Ultra C equipment is designed to remove random defects from a wafer surface, even at an advanced process node (the minimum line width on a chip) of 22 nanometers (nm) or less. Its equipment is based on its Space Alternated Phase Shift (SAPS) and Timely Energized Bubble Oscillation (TEBO) technologies. Its SAPS technology uses alternating phases of megasonic waves to deliver megasonic energy to flat and patterned wafer surfaces in a uniform manner on a microscopic level. Its TEBO technology provides cleaning for both conventional two-dimensional (2D) and three-dimensional (3D) patterned wafers at advanced process nodes.

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