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Amkor Technology Inc AMKR.OQ (NASDAQ Stock Exchange Global Select Market)

7.01 USD
+0.19 (+2.71%)
As of 3:26 PM EDT
chart
Previous Close 6.82
Open 6.81
Volume 158,785
3m Avg Volume 247,191
Today’s High 7.10
Today’s Low 6.77
52 Week High 11.88
52 Week Low 6.62
Shares Outstanding (mil) 239.54
Market Capitalization (mil) 1,650.42
Forward P/E 10.60
Dividend (Yield %) -- ( -- )

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Sell Hold Buy
3.33 Mean rating from 3 analysts

KEY STATS

Revenue (mm, USD)
FY18
2,091
FY17
4,191
FY16
3,894
FY15
2,885
EPS (USD)
FY18
0.176
FY17
0.909
FY16
0.687
FY15
0.215
*Note: Units in Millions of U.S. Dollars
**Note: Units in U.S. Dollars

KEY RATIOS

Price to Earnings (TTM)
vs sector
10.60
12.98
Price to Sales (TTM)
vs sector
0.38
267.47
Price to Book (MRQ)
vs sector
0.94
2.07
Price to Cash Flow (TTM)
vs sector
2.23
14.26
Total Debt to Equity (MRQ)
vs sector
76.16
15.52
LT Debt to Equity (MRQ)
vs sector
69.57
7.74
Return on Investment (TTM)
vs sector
5.17
17.51
Return on Equity (TTM)
vs sector
9.58
18.66

EXECUTIVE LEADERSHIP

James Kim
Executive Chairman of the Board, Since 2009
Salary: --
Bonus: $1,253,070.00
Stephen Kelley
President, Chief Executive Officer, Director, Since 2013
Salary: $800,962.00
Bonus: $1,476,830.00
John Kim
Executive Vice Chairman of the Board, Since 2015
Salary: --
Bonus: $422,663.00
Megan Faust
Chief Financial Officer, Corporate Vice President, Since 2016
Salary: $312,866.00
Bonus: $313,268.00
Gil Tily
Executive Vice President, Chief Administrative Officer, General Counsel, Corporate Secretary, Since 2008
Salary: $605,731.00
Bonus: $687,531.00

COMPANY PROFILE

Sector: Technology
Industry: Semiconductor Equipment & Testing
Address:

2045 East Innovation Circle
TEMPE   AZ   85284

Phone: +1480.8215000

Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company's packaging and test services are designed to meet application and chip specific requirements, including the type of interconnect technology; size, thickness and electrical, and mechanical and thermal performance. It provides packaging and test services, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, system-level, and final test and drop shipment services. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies and contract foundries. IDMs design, manufacture, package and test semiconductors in their own facilities. The Company offers a range of advanced and mainstream packaging and test services. The Company's mainstream packages include leadframe packages, substrate-based wirebond packages and micro-electro-mechanical systems packages.

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