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ChipMOS Technologies Inc IMOS.OQ (NASDAQ Stock Exchange Global Select Market)

17.06 USD
+0.82 (+5.05%)
As of Mar 20
chart
Previous Close 16.24
Open 16.85
Volume 8,176
3m Avg Volume 5,060
Today’s High 17.09
Today’s Low 16.85
52 Week High 19.94
52 Week Low 14.42
Shares Outstanding (mil) 37.64
Market Capitalization (mil) 616.64
Forward P/E 16.12
Dividend (Yield %) 0.97 ( 1.40 )

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KEY STATS

Revenue (mm, TWD)
FY18
18,480
FY17
17,941
FY16
13,720
EPS (TWD)
FY18
1.551
FY17
1.594
FY16
1.382
*Note: Units in Millions of Taiwanese Dollars
**Note: Units in Taiwanese Dollars

KEY RATIOS

Price to Earnings (TTM)
vs sector
16.12
11.09
Price to Sales (TTM)
vs sector
1.03
25.62
Price to Book (MRQ)
vs sector
0.86
1.84
Price to Cash Flow (TTM)
vs sector
4.24
15.01
Total Debt to Equity (MRQ)
vs sector
54.27
17.54
LT Debt to Equity (MRQ)
vs sector
50.04
10.26
Return on Investment (TTM)
vs sector
4.05
16.21
Return on Equity (TTM)
vs sector
6.05
17.52

EXECUTIVE LEADERSHIP

Shijie Zheng
Chairman of the Board, General Manager, Since 2012
Salary: --
Bonus: --
Lianfa Zhuo
Chief Operating Officer, Executive Deputy General Manager, Since 2017
Salary: --
Bonus: --
Guoliang Huang
Deputy General Manager-Main Encapsulation Production Unit, Director, Since
Salary: --
Bonus: --
Lijun Li
Executive Deputy General Manager-Operation & Production Center, Director, Since
Salary: --
Bonus: --
Changlong Li
Deputy General Manager-Information Technology Administration Center, Since 2014
Salary: --
Bonus: --

COMPANY PROFILE

Sector: Technology
Industry: Semiconductor Equipment & Testing
Address:

No. 1, R&D Road 1, Hsinchu Scien
BAOSHAN     308

Phone: +8863.5770055

ChipMOS TECHNOLOGIES INC is a Taiwan-based company principally engaged in the integrated circuits (IC) packaging and testing business. The Company mainly provides thin small outline packaging (TSOP), fine-pitch ball grid array (FBGA) packaging, tape carrier packaging (TCP) and chip on film (COF) packaging services, as well as gold bumping services and others. The Company’s products and services are applied in information products, personal computers, communication equipment, office automation and consumer electronics. It mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.

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