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Kulicke and Soffa Industries Inc KLIC.OQ (NASDAQ Stock Exchange Global Select Market)

22.53 USD
+0.33 (+1.49%)
As of 1:15 PM EDT
Previous Close 22.20
Open 22.20
Volume 47,505
3m Avg Volume 140,266
Today’s High 22.70
Today’s Low 22.20
52 Week High 28.41
52 Week Low 17.41
Shares Outstanding (mil) 65.02
Market Capitalization (mil) 1,443.43
Forward P/E 14.97
Dividend (Yield %) 0.12 ( 2.16 )

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RECOMMENDATION

Sell Hold Buy
2.33 Mean rating from 6 analysts

KEY STATS

Revenue (mm, USD)
FY19
273
FY18
889
FY17
809
FY16
627
EPS (USD)
FY19
0.208
FY18
2.297
FY17
1.881
FY16
0.684
*Note: Units in Millions of U.S. Dollars
**Note: Units in U.S. Dollars

KEY RATIOS

Price to Earnings (TTM)
vs sector
14.97
13.74
Price to Sales (TTM)
vs sector
1.99
18.14
Price to Book (MRQ)
vs sector
1.76
7.90
Price to Cash Flow (TTM)
vs sector
11.74
11.02
Total Debt to Equity (MRQ)
vs sector
3.02
15.60
LT Debt to Equity (MRQ)
vs sector
1.81
9.10
Return on Investment (TTM)
vs sector
10.45
14.17
Return on Equity (TTM)
vs sector
12.09
15.65

EXECUTIVE LEADERSHIP

Garrett Pierce
Chairman of the Board, Since 2014
Salary: --
Bonus: --
Fusen Chen
President, Chief Executive Officer, Director, Since 2016
Salary: --
Bonus: --
Lester Wong
Chief Financial Officer, Senior Vice President - Legal Affairs, Interim Chief Accounting Officer, General Counsel, Since 2018
Salary: $296,806.00
Bonus: $40,000.00
Hoang Hoang
Senior Vice President - Global Sales and Products and Services, Since 2017
Salary: --
Bonus: --
Chan Pin Chong
Senior Vice President , Electronic Assembly, Advanced Packaging-Hybrid, Wedge Bonder, Capillaries and Blades Business Lines, Since 2016
Salary: $277,874.00
Bonus: $105,785.00

COMPANY PROFILE

Sector: Technology
Industry: Semiconductor Equipment & Testing
Address:

23A Serangoon North Avenue 5
#01-01 K&S Corporate Headquarter
    554369

Phone: +656.8809600

Kulicke and Soffa Industries, Inc. designs, manufactures and sells capital equipment and expendable tools used to assemble semiconductor devices, including integrated circuits (ICs), high and low powered discrete devices, light-emitting diodes (LEDs) and power modules. The Company also services, maintains, repairs and upgrades equipment, all used to assemble semiconductor devices. The Company supplies a range of bonding equipment. It operates through two segments: Capital Equipment and Aftermarket Products and Services (APS). The Capital Equipment segment manufactures and sells a line of ball bonders, wedge bonders, advanced packaging and surface mount technology solutions. The APS segment manufactures and sells expendable tools for a range of semiconductor packaging applications. Its customers primarily consist of semiconductor device manufacturers, outsourced semiconductor assembly and test providers (OSATs), other electronics manufacturers and automotive electronics suppliers.

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